He Tang
Orcid: 0000-0001-8624-5671Affiliations:
- University of Electronic Science and Technology of China, Chengdu, Sichuan, China
According to our database1,
He Tang
authored at least 39 papers
between 2010 and 2025.
Collaborative distances:
Collaborative distances:
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Bibliography
2025
A Neural Network-Enhanced Digital Background Calibration Algorithm for Residue Amplifier Nonlinearity in Pipelined ADCs.
IEEE Trans. Circuits Syst. II Express Briefs, August, 2025
Kolmogorov-Arnold Networks-Based Calibration for Single-Channel ADCs: High-Precision Nonlinear Code Synthesis With Low Power Consumption.
IEEE Trans. Circuits Syst. I Regul. Pap., June, 2025
A Novel NN-Based Fast-Convergence Background Calibration for Timing Mismatch in TI ADCs.
IEEE Trans. Circuits Syst. II Express Briefs, January, 2025
2024
A New Artificial Neural Network-Based Calibration Mechanism for ADCs: A Time-Interleaved ADC Case Study.
IEEE Trans. Very Large Scale Integr. Syst., July, 2024
IEEE Trans. Circuits Syst. II Express Briefs, July, 2024
2023
IEEE Trans. Very Large Scale Integr. Syst., June, 2023
2022
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022
2021
IEEE Trans. Very Large Scale Integr. Syst., 2021
IEEE Trans. Computers, 2021
2020
IEEE Trans. Very Large Scale Integr. Syst., 2020
Compact Piecewise Linear Model Based Temperature Control of Multicore Systems Considering Leakage Power.
IEEE Trans. Ind. Informatics, 2020
IEEE Trans. Circuits Syst., 2020
A 8.2-pW 2.4-pA Current Reference Operating at 0.5 V With No Amplifiers or Resistors.
IEEE Trans. Circuits Syst. II Express Briefs, 2020
Leakage-Aware Predictive Thermal Management for Multicore Systems Using Echo State Network.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020
2019
IEEE Trans. Very Large Scale Integr. Syst., 2019
Runtime Stress Estimation for Three-dimensional IC Reliability Management Using Artificial Neural Network.
ACM Trans. Design Autom. Electr. Syst., 2019
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019
GDP: A Greedy Based Dynamic Power Budgeting Method for Multi/Many-Core Systems in Dark Silicon.
IEEE Trans. Computers, 2019
IEEE J. Solid State Circuits, 2019
Leakage-aware thermal management for multi-core systems using piecewise linear model based predictive control.
Proceedings of the 24th Asia and South Pacific Design Automation Conference, 2019
2018
IEEE Trans. Computers, 2018
Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018
2017
Integr., 2017
2016
Hierarchical Dynamic Thermal Management Method for High-Performance Many-Core Microprocessors.
ACM Trans. Design Autom. Electr. Syst., 2016
A Systematic Study of ESD Protection Co-Design With High-Speed and High-Frequency ICs in 28 nm CMOS.
IEEE Trans. Circuits Syst. I Regul. Pap., 2016
2015
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015
2014
Proceedings of the IEEE 57th International Midwest Symposium on Circuits and Systems, 2014
Scalable behavior modeling for SCR based ESD protection structures for circuit simulation.
Proceedings of the IEEE International Symposium on Circuits and Systemss, 2014
Proceedings of the 2014 IEEE Asia Pacific Conference on Circuits and Systems, 2014
2013
IEEE J. Solid State Circuits, 2013
Proceedings of the IEEE 10th International Conference on ASIC, 2013
Distributed task migration for thermal hot spot reduction in many-core microprocessors.
Proceedings of the IEEE 10th International Conference on ASIC, 2013
2011
IEEE Trans. Ind. Electron., 2011
IEEE J. Solid State Circuits, 2011
J. Low Power Electron., 2011
Sci. China Inf. Sci., 2011
2010
A 52-mW 3.1-10.6-GHz Fully Integrated Correlator for IR-UWB Transceivers in 0.18 μm CMOS.
IEEE Trans. Ind. Electron., 2010
1.8 pJ/Pulse Programmable Gaussian Pulse Generator for Full-Band Noncarrier Impulse-UWB Transceivers in 90-nm CMOS.
IEEE Trans. Ind. Electron., 2010