Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations. - A. Aubert; Lionel Dantas de Morais; J. P. Rebrasse (Microelectron. Reliab., 2008)

Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. - A. Aubert; J. P. Rebrasse; Lionel Dantas de Morais; Nathalie Labat; Hélène Frémont (Microelectron. Reliab., 2010)

Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow. - A. Aubert; Sébastien Jacques; S. Pétremont; Nathalie Labat; Hélène Frémont (Microelectron. Reliab., 2011)