Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding. - Weng Hong Teh; C. Deeb; J. Burggraf; D. Arazi; R. Young; C. Senowitz; A. Buxbaum (3DIC, 2010)