Electrical qualification of new ultrathin integration techniques. - A. Cazarré; F. Lépinois; A. Marty; S. Pinel; J. Tasselli; J. P. Bailbé; J. R. Morante; F. Murray (Microelectron. Reliab., 2003)

Potentialities of substrate-thinning technique to control minority carrier injection in smart power IC's. - C. Lochot; Jean-Philippe Lainé; Marise Bafleur; A. Cazarré; J. Tasselli (Microelectron. J., 2006)