Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue. - B. Khong; Patrick Tounsi; Philippe Dupuy; X. Chauffleur; Marc Legros; A. Deram; Colette Levade; G. Vanderschaeve; Jean-Marie Dorkel; Jean-Pierre Fradin (Microelectron. Reliab., 2005)

3D electro-thermal investigations for reliability of ultra low ON state resistance power MOSFET. - Jean-Baptiste Sauveplane; Patrick Tounsi; Emmanuel Scheid; A. Deram (Microelectron. Reliab., 2008)

On the accurate determination of the thermomechanical properties of micro-scale material: Application to AlSi1% chip metallization of a power semiconductor device. - Jean-Baptiste Sauveplane; Emmanuel Scheid; A. Deram (Microelectron. Reliab., 2009)