Thermal resistance investigations on new leadframe-based LED packages and boards. - B. Pardo; A. Gasse; A. Fargeix; Jiri Jakovenko; Robert J. Werkhoven; Xavier Perpiñà; Xavier Jordà; Miquel Vellvehí; T. Van Weelden; P. Bancken (Microelectron. Reliab., 2013)