Thermal characterizations of Cu nanoparticle joints for power semiconductor devices. - Toshitaka Ishizaki; T. Satoh; A. Kuno; A. Tane; Masashi Yanase; F. Osawa; Yasushi Yamada (Microelectron. Reliab., 2013)

Reliability of Cu nanoparticle joint for high temperature power electronics. - Toshitaka Ishizaki; A. Kuno; A. Tane; Masashi Yanase; F. Osawa; T. Satoh; Yasushi Yamada (Microelectron. Reliab., 2014)

Thermal simulation of joints with high thermal conductivities for power electronic devices. - Toshitaka Ishizaki; Masashi Yanase; A. Kuno; T. Satoh; Masanori Usui; F. Osawa; Yasushi Yamada (Microelectron. Reliab., 2015)

Young's modulus of a sintered Cu joint and its influence on thermal stress. - Toshitaka Ishizaki; D. Miura; A. Kuno; K. Hasegawa; Masanori Usui; Y. Yamada (Microelectron. Reliab., 2017)