Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures. - Y. Yang; Riet Labie; F. Ling; C. Zhao; A. Radisic; Jan Van Olmen; Youssef Travaly; Bert Verlinden; Ingrid De Wolf (Microelectron. Reliab., 2010)