Thermal characterizations of Cu nanoparticle joints for power semiconductor devices. - Toshitaka Ishizaki; T. Satoh; A. Kuno; A. Tane; Masashi Yanase; F. Osawa; Yasushi Yamada (Microelectron. Reliab., 2013)

Reliability of Cu nanoparticle joint for high temperature power electronics. - Toshitaka Ishizaki; A. Kuno; A. Tane; Masashi Yanase; F. Osawa; T. Satoh; Yasushi Yamada (Microelectron. Reliab., 2014)