Role of process parameters on bondability and pad damage indicators in copper ball bonding. - I. Qin; Aashish Shah; C. Huynh; M. Meyer; M. Mayer; Norman Y. Zhou (Microelectron. Reliab., 2011)

Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. - Aashish Shah; Alireza Rezvani; M. Mayer; Norman Y. Zhou; John Persic; J. T. Moon (Microelectron. Reliab., 2011)

Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding. - Alireza Rezvani; Aashish Shah; M. Mayer; Norman Y. Zhou; J. T. Moon (Microelectron. Reliab., 2013)