Through glass via thermomechanical analysis: Geometrical parameters effect on thermal stress. - Abdellah Benali; Mohsine Bouya; Mustapha Faqir; Abderrahim El Amrani; Mounir Ghogho; A. Benabdellah (IDT, 2013)

A study of through package vias in a glass interposer for multifunctional and miniaturized systems. - Abderrahim El Amrani; Abdellah Benali; Mohsine Bouya; Mustapha Faqir; K. Demir; Abdelkader Hadjoudja; Mounir Ghogho (Microelectron. Reliab., 2014)