Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges. - Joeri De Vos; Vladimir Cherman; Mikael Detalle; Teng Wang; Abdellah Salahouelhadj; Robert Daily; Geert Van der Plas; Eric Beyne (3DIC, 2014)

Reliability of thermally stressed rigid-flex printed circuit boards for High Density Interconnect applications. - Abdellah Salahouelhadj; Marion Martiny; Sebastien Mercier; Laurent Bodin; David Manteigas; B. Stephan (Microelectron. Reliab., 2014)