Reliability modeling of Sn-Ag transient liquid phase die-bonds for high-power SiC devices. - Adeel Ahmad Bajwa; Jürgen Wilde (Microelectron. Reliab., 2016)

Integrated neural interfaces. - Ross M. Walker; Loren Rieth; Subramanian S. Iyer; Adeel Ahmad Bajwa; Jason Silver; Taufiq Ahmed; Naila Tasneem; Mohit Sharma; A. Tye Gardner (MWSCAS, 2017)

A Case for Packageless Processors. - Saptadeep Pal; Daniel Petrisko; Adeel Ahmad Bajwa; Puneet Gupta 001; Subramanian S. Iyer; Rakesh Kumar 002 (HPCA, 2018)

Reliability challenges in advance packaging. - Subramanian S. Iyer; Adeel Ahmad Bajwa (IRPS, 2018)

Network on interconnect fabric. - Boris Vaisband; Adeel Ahmad Bajwa; Subramanian S. Iyer (ISQED, 2018)

Reliability Evaluation of Silicon Interconnect Fabric Technology. - Kannan K. Thankappan; Adeel Ahmad Bajwa; Boris Vaisband; SivaChandra Jangam; Subramanian S. Iyer (IRPS, 2019)