Junction-level thermal extraction and simulation of 3DICs. - Samson Melamed; Thorlindur Thorolfsson; Adi Srinivasan; Edmund Cheng; Paul D. Franzon; William Rhett Davis (3DIC, 2009)

Fine grain thermal modeling and experimental validation of 3D-ICs. - Herman Oprins; Adi Srinivasan; Miroslav Cupák; Vladimir Cherman; Cristina Torregiani; Michele Stucchi; Geert Van der Plas; Paul Marchal; Bart Vandevelde; E. Cheng (Microelectron. J., 2011)