Reliability challenges in Forksheet Devices: (Invited Paper). - Erik Bury; Michiel Vandemaele; Jacopo Franco; Adrian Chasin; Stanislav Tyaginov; A. Vandooren; Romain Ritzenthaler; Hans Mertens; Javier Diaz-Fortuny; N. Horiguchi; Dimitri Linten; Ben Kaczer (IRPS, 2023)

Investigating Nanowire, Nanosheet and Forksheet FET Hot-Carrier Reliability via TCAD Simulations: Invited Paper. - Michiel Vandemaele; Ben Kaczer; Erik Bury; Jacopo Franco; Adrian Chasin; Alexander Makarov; Hans Mertens; Geert Hellings; Guido Groeseneken (IRPS, 2023)

Gate Stack Development for Next Gen High Voltage Periphery DRAM Devices. - J. P. Bastos; Jacopo Franco; Barry J. O'Sullivan; Yusuke Higashi; Adrian Chasin; J. Ganguly; Hiroaki Arimura; Alessio Spessot; M.-S. Kim; N. Horiguchi (IRPS, 2025)

Advanced RTN Analysis on 3D NAND Trench Devices Using Physics-Informed Machine Learning Framework. - Yusuke Higashi; Anirudh Varanasi; Philippe J. Roussel; Pablo Saraza-Canflanca; J. P. Bastos; Alexander Grill; E. Catapano; R. Asanovski; Jacopo Franco; Ben Kaczer; Adrian Chasin; Devin Verreck; et al. (IRPS, 2025)