Electromigration behavior of dual-damascene Cu interconnects–Structure, width, and length dependences. - A. V. Vairagar; S. G. Mhaisalkar; Ahila Krishnamoorthy (Microelectron. Reliab., 2004)

A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects. - M. Y. Yan; King-Ning Tu; A. V. Vairagar; S. G. Mhaisalkar; Ahila Krishnamoorthy (Microelectron. Reliab., 2006)

Performance properties in thick film silicate dielectric layers using molecular modeling. - Nancy Iwamoto; Ahila Krishnamoorthy; Richard Spear (Microelectron. Reliab., 2009)