Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy. - M. N. Islam; Yan Cheong Chan; Ahmed Sharif; M. O. Alam (Microelectron. Reliab., 2003)

Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages. - Asit Kumar Gain; Y. C. Chan; Ahmed Sharif; N. B. Wong; Winco K. C. Yung (Microelectron. Reliab., 2009)

Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy. - Mansur Ahmed; Tama Fouzder; Ahmed Sharif; Asit Kumar Gain; Y. C. Chan (Microelectron. Reliab., 2010)

Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads. - Tama Fouzder; Asit Kumar Gain; Y. C. Chan; Ahmed Sharif; Winco K. C. Yung (Microelectron. Reliab., 2010)

Customized glass sealant for ceramic substrates for high temperature electronic application. - Ahmed Sharif; Chee Lip Gan; Zhong Chen 004 (Microelectron. Reliab., 2014)

Cost effective solar-biogas hybrid power generation system. - Joan D'Rozario; Sabrina Shams; Shahinur Rahman; Ahmed Sharif; Enamul Basher (ICIT, 2015)