Lattice Boltzmann Model of 3D Multiphase Flow in Artery Bifurcation Aneurysm Problem. - Aizat Abas; Noorhafizah Hafizah Mokhtar; Muhammad Hafifi Hafiz Ishak; Mohd Zulkifly Abdullah; Ang H. O. Tian (Comput. Math. Methods Medicine, 2016)

Lattice Boltzmann method study of bga bump arrangements on void formation. - Aizat Abas; Muhammad Hafifi Hafiz Ishak; Mohd Zulkifly Abdullah; F. Che Ani; Soon Fuat Khor (Microelectron. Reliab., 2016)

Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process. - Muhammad Hafifi Hafiz Ishak; Mohd Zulkifly Abdullah; Aizat Abas (Microelectron. Reliab., 2016)

Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. - Fei Chong Ng; Aizat Abas; Muhammad Hafifi Hafiz Ishak; Mohd Zulkifly Abdullah; M. S. Abdul Aziz (Microelectron. Reliab., 2016)

Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages. - M. S. Haslinda; Aizat Abas; F. Che Ani; A. Jalar; Abdullah Aziz Saad; Mohd Zulkifly Abdullah (Microelectron. Reliab., 2017)

Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings. - Fei Chong Ng; Aizat Abas; Z. L. Gan; Mohd Zulkifly Abdullah; F. Che Ani; M. Yusuf Tura Ali (Microelectron. Reliab., 2017)

Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. - Fei Chong Ng; Aizat Abas; Mohd Zulkifly Abdullah (Microelectron. Reliab., 2018)

No-flow underfill: Effect of chip placement speed on the void formation using numerical method. - Muhammad Naqib Nashrudin; Aizat Abas; M. Z. Abdullah; M. Yusuf Tura Ali; Z. Samsudin; Idris Mansor (Microelectron. J., 2021)