High frequency signal transmission characteristics of cone bump interconnections. - Akihiro Ikeda; Naoya Watanabe; Tanemasa Asano (3DIC, 2011)

Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration. - Takanori Shuto; Naoya Watanabe; Akihiro Ikeda; Tanemasa Asano (3DIC, 2011)

Development and Evaluation of a Miniaturized Taste Sensor Chip. - Yusuke Tahara; Akihiro Ikeda; Yoshihiro Maehara; Masaaki Habara; Kiyoshi Toko (Sensors, 2011)

Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. - Akihiro Ikeda; L. J. Qiu; K. Nakahara; Tanemasa Asano (3DIC, 2013)

Data and Information Activities of ICSWSE, Kyushu University, Japan. - Shuji Abe; Kiyohumi Yumoto; Akihiro Ikeda; Teiji Uozumi; George Maeda (Data Sci. J., 2013)

Development of a Portable Taste Sensor with a Lipid/Polymer Membrane. - Yusuke Tahara; Kenichi Nakashi; Ke Ji; Akihiro Ikeda; Kiyoshi Toko (Sensors, 2013)

High-speed via hole filling using electrophoresis of Ag nanoparticles. - Ryo Takigawa; Kohei Nitta; Akihiro Ikeda; Mitsuaki Kumazawa; Toshiharu Hirai; Michio Komatsu; Tanemasa Asano (3DIC, 2015)

Formal verification for wireless sensor network in consideration of communication errors. - Akihiro Ikeda; Naoki Akiyama; Toshiaki Miyazaki (ICOIN, 2018)

Formation of Low Resistance Contacts to p-type 4H-SiC using Al-Film Source Laser Doping. - Kento Okamoto; Toshifumi Kikuchi; Akihiro Ikeda; Hiroshi Ikenoue; Tanemasa Asano (PHOTOPTICS, 2019)