Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. - Ji Chel Bea; Mariappan Murugesan; Yuki Ohara; Akihiro Noriki; Hisashi Kino; Kang Wook Lee 002; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi (3DIC, 2009)

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. - Yuki Ohara; Akihiro Noriki; Katsuyuki Sakuma; Kang Wook Lee 002; Mariappan Murugesan; Jichoel Bea; Fumiaki Yamada; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi (3DIC, 2009)

Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI. - Akihiro Noriki; Kang Wook Lee 002; Jichoel Bea; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi (3DIC, 2010)

Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI. - Akihiro Noriki; Kang Wook Lee 002; Jichoel Bea; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi (3DIC, 2011)

Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror. - Akihiro Noriki; Isao Tamai; Yasuhiro Ibusuki; Akio Ukita; Satoshi Suda; Daisuke Shimura; Yosuke Onawa; Hiroki Yaegashi; Takeru Amano (3DIC, 2019)

Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers. - Koichi Takemura; Akio Ukita; Yasuhiro Ibusuki; Mitsuru Kurihara; Akihiro Noriki; Takeru Amano; Daisuke Okamoto; Yasuyuki Suzuki; Kazuhiko Kurata (3DIC, 2019)

Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors. - Akihiro Noriki; Isao Tamai; Yasuhiro Ibusuki; Akio Ukita; Satoshi Suda; Koichi Takemura; Daisuke Shimura; Yosuke Onawa; Hiroki Yaegashi; Takeru Amano (ECOC, 2020)

Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate. - Takeru Amano; Akihiro Noriki; Isao Tamai; Yasuhiro Ibusuki; Akio Ukita; Satoshi Suda; Takayuki Kurosu; Koichi Takemura; Tsuyoshi Aoki; Daisuke Shimura; Yosuke Onawa; Hiroki Yaegashi (OFC, 2021)

Thermal Analysis of Reflow Process for PIC-Embedded Package Substrate with 2.3D RDL Interposer for Co-Packaged Optics. - Akihiro Noriki; Hirotaka Uemura; Haruhiko Kuwatsuka; Naoki Matsui; Reona Motoji; Dan Maeda; Tomoya Sugita; Fumi Nakamura; Takeru Amano (3DIC, 2024)