Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs. - Takuji Miki; Makoto Nagata; Akihiro Tsukioka; Noriyuki Miura; Takaaki Okidono; Yuuki Araga; Naoya Watanabe; Haruo Shimamoto; Katsuya Kikuchi (3DIC, 2019)