Low temperature Au-Au bonding with VUV/O3 treatment. - Akiko Okada; Masatsugu Nimura; Naoko Unami; Akitsu Shigetou; Hirokazu Noma; Katsuyuki Sakuma; Jun Mizuno; Shuichi Shoji (3DIC, 2011)

Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding. - Ryuichi Kondou; Chenxi Wang; Akitsu Shigetou; Tadatomo Suga (Microelectron. Reliab., 2012)

Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection. - Masaki Ohyama; Masatsugu Nimura; Jun Mizuno; Shuichi Shoji; Toshihisa Nonaka; Yoichi Shinba; Akitsu Shigetou (Microelectron. Reliab., 2016)

Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration. - Akitsu Shigetou; Tilo H. Yang; C. Robert Kao (3DIC, 2019)