Equivalent lumped element models for various n-port Through Silicon Vias networks. - Khaled Salah 001; Hani F. Ragai; Yehea I. Ismail; Alaa B. El-Rouby (ASP-DAC, 2011)

Body contact based TSV equalizer. - Khaled Mohamed; Alaa B. El-Rouby; Yehea I. Ismail; Hani F. Ragai (IDT, 2011)

Compact lumped element model for TSV in 3D-ICs. - Khaled Salah 001; Alaa B. El-Rouby; Hani F. Ragai; Karim Amin; Yehea I. Ismail (ISCAS, 2011)

Effect of non-uniform substrate doping profile on the electrical performance of through-silicon-via for low power application. - Khaled Salah 001; Alaa B. El-Rouby; Hani F. Ragai; Yehea Ismail (ICEAC, 2012)

Modeling and analysis of through silicon via: Electromagnetic and device simulation approach. - Khaled Salah 001; Alaa B. El-Rouby; Hani F. Ragai; Yehea I. Ismail (ICECS, 2012)

A closed form expression for TSV-based on-chip spiral inductor. - Khaled Salah 001; Alaa B. El-Rouby; Hani F. Ragai; Yehea I. Ismail (ISCAS, 2012)

An accurate power delivery system (PDS) design methodology for high-speed digital systems. - Shaymaa M. Nabil; Alaa B. El-Rouby; Ahmed H. Khalil (Int. J. Circuit Theory Appl., 2012)

Current source based standard-cell model for accurate timing analysis of combinational logic cells. - Mohamed Mahmoud; Amr Wassal; Alaa B. El-Rouby; Rafik Guindi (ICECS, 2013)

TSV-based on-chip inductive coupling communications. - Khaled Salah 001; Alaa B. El-Rouby; Hani F. Ragai; Yehea I. Ismail (ISCAS, 2013)

Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays. - Kareem Ali; Eslam Yahya; Alaa B. El-Rouby; Yehea Ismail (ICEAC, 2015)

Library based macro-modeling methodology for Through Silicon Via (TSV) arbitrary arrays. - Karim Ali 003; Eslam Yahya; Alaa B. El-Rouby; Yehea I. Ismail (Microelectron. J., 2015)

Sectoring Approach for Performance Enhancement of MTT and Its Application on JPDA Algorithm. - Mustafa Latif Cobankaya; Alaa B. El-Rouby (IEEE Access, 2025)