Co-simulation based platform for wireless protocols design explorations. - Alain Fourmigue; Bruno Girodias; Gabriela Nicolescu; El Mostapha Aboulhamid (DATE, 2009)

A linear-time approach for the transient thermal simulation of liquid-cooled 3d ics. - Alain Fourmigue; Giovanni Beltrame; Gabriela Nicolescu; El Mostapha Aboulhamid (CODES+ISSS, 2011)

Multi-granularity thermal evaluation of 3D MPSoC architectures. - Alain Fourmigue; Giovanni Beltrame; Gabriela Nicolescu; El Mostapha Aboulhamid; Ian O'Connor (DATE, 2011)

Explicit transient thermal simulation of liquid-cooled 3D ICs. - Alain Fourmigue; Giovanni Beltrame; Gabriela Nicolescu (DATE, 2013)

Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias. - Alain Fourmigue; Giovanni Beltrame; Gabriela Nicolescu (DATE, 2014)

Thermal aware design method for VCSEL-based on-chip optical interconnect. - Hui Li 034; Alain Fourmigue; Sébastien Le Beux; Xavier Letartre; Ian O'Connor; Gabriela Nicolescu (DATE, 2015)

Towards Maximum Energy Efficiency in Nanophotonic Interconnects with Thermal-Aware On-Chip Laser Tuning. - Hui Li 034; Alain Fourmigue; Sébastien Le Beux; Ian O'Connor; Gabriela Nicolescu (IEEE Trans. Emerg. Top. Comput., 2018)