Surface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching - Alain Phommahaxay; Gaëlle Lissorgues; Lionel Rousseau; Tarik Bourouina; Pierre Nicole (CoRR, 2007)

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. - Anne Jourdain; Thibault Buisson; Alain Phommahaxay; Mark Privett; Dan Wallace; Sumant Sood; Peter Bisson; Eric Beyne; Youssef Travaly; Bart Swinnen (3DIC, 2010)

Design issues and considerations for low-cost 3D TSV IC technology. - Geert Van der Plas; Paresh Limaye; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Domae Shinichi; Vladimir Cherman; et al. (ISSCC, 2010)

In-line metrology and inspection for process control during 3D stacking of IC's. - Sandip Halder; Ingrid De Wolf; Alain Phommahaxay; Andy Miller; Mireille Maenhoudt; Gerald Beyer; Bart Swinnen; Eric Beyne (3DIC, 2011)

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. - Alain Phommahaxay; Anne Jourdain; Greet Verbinnen; Tobias Woitke; Peter Bisson; Markus Gabriel; Walter Spiess; Alice Guerrero; Jeremy McCutcheon; Rama Puligadda; Pieter Bex; Axel Van den Eede; et al. (3DIC, 2011)

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. - Geert Van der Plas; Paresh Limaye; Igor Loi; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Vladimir Cherman; et al. (IEEE J. Solid State Circuits, 2011)

Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. - Joeri De Vos; Lan Peng; Alain Phommahaxay; Joost Van Ongeval; Andy Miller; Eric Beyne; Florian Kurz; Thomas Wagenleiter; Markus Wimplinger; Thomas Uhrmann (3DIC, 2016)

Protective Layer for Collective Die to Wafer Hybrid Bonding. - Fumihiro Inoue; Julien Bertheau; Samuel Suhard; Alain Phommahaxay; Takuya Ohashi; Tetsuro Kinoshita; Yohei Kinoshita; Eric Beyne (3DIC, 2019)

Process Complexity and Cost Considerations of Multi-Layer Die Stacks. - Dimitrios Velenis; Joeri De Vos; Soon-Wook Kim; Jaber Derakhshandeh; Pieter Bex; Giovanni Capuz; Samuel Suhard; Kenneth June Rebibis; Stefaan Van Huylenbroeck; Erik Jan Marinissen; Alain Phommahaxay; Andy Miller; et al. (3DIC, 2019)

Clean Dicing: An Alternative Blade Dicing Technique for Minimising Particles in 3D Heterogeneous Integration. - Akito Hiro; Damien Jon Leech; Geert Schoofs; John Slabbekoorn; Alain Phommahaxay; Koen Kennes; Gerald Beyer; Eric Beyne (3DIC, 2024)