Second Generation Small Pixel Technology Using Hybrid Bond Stacking. - Vincent C. Venezia; Alan Chih-Wei Hsiung; Wu-Zang Yang; Yuying Zhang; Cheng Zhao; Zhiqiang Lin; Lindsay A. Grant (Sensors, 2018)

A 2.2um three-wafer stacked back side illuminated voltage domain global shutter CMOS image sensor. - Shimpei Fukuoka; Masayuki Uchiyama; Geunsook Park; Alan Chih-Wei Hsiung; Mourad Daoudi; Zhiqiang Lin; Vincent C. Venezia; Lindsay A. Grant (Imaging Sensors and Systems, 2023)