"Zeppelin": An SoC for Multichip Architectures. - Thomas Burd; Noah Beck; Sean White; Milam Paraschou; Nathan Kalyanasundharam; Gregg Donley; Alan Smith 003; Larry Hewitt; Samuel Naffziger (IEEE J. Solid State Circuits, 2019)

Experiences with ML-Driven Design: A NoC Case Study. - Jieming Yin; Subhash Sethumurugan; Yasuko Eckert; Chintan Patel; Alan Smith 003; Eric Morton; Mark Oskin; Natalie D. Enright Jerger; Gabriel H. Loh (HPCA, 2020)

AMD InstinctTM MI250X Accelerator enabled by Elevated Fanout Bridge Advanced Packaging Architecture. - Raja Swaminathan; Michael J. Schulte; Brett Wilkerson; Gabriel H. Loh; Alan Smith 003; Norman James (VLSI Technology and Circuits, 2023)

Realizing the AMD Exascale Heterogeneous Processor Vision : Industry Product. - Alan Smith 003; Gabriel H. Loh; Michael J. Schulte; Mike Ignatowski; Samuel Naffziger; Mike Mantor; Nathan Kalyanasundharam; Vamsi Alla; Nicholas Malaya; Joseph L. Greathouse; Eric Chapman; Raja Swaminathan (ISCA, 2024)

AMD Instinct™ MI300X Accelerator: Packaging and Architecture Co-Optimization. - Alan Smith 003; Gabriel H. Loh; John J. Wuu; Samuel Naffziger; Tyrone Huang; Hugh McIntyre; Ramon Mangaser; Wonjun Jung; Raja Swaminathan (VLSI Technology and Circuits, 2024)

AMD Instinct MI300X: A Generative AI Accelerator and Platform Architecture. - Alan Smith 003; Vamsi Krishna Alla (IEEE Micro, 2025)

Interconnect Design for Heterogeneous Integration of Chiplets in the AMD Instinct MI300X Accelerator. - Alan Smith 003; Gabriel H. Loh; Samuel Naffziger; John J. Wuu; Nathan Kalyanasundharam; Eric Chapman; Raja Swaminathan; Tyrone Huang; Wonjun Jung; Alexander Kaganov; Hugh McIntyre; Ramon Mangaser (IEEE Micro, 2025)