The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment. - Albert T. Wu; Y. C. Ding (Microelectron. Reliab., 2009)

Reliability of micro-interconnects in 3D IC packages. - C. Robert Kao; Albert T. Wu; King-Ning Tu; Yi-Shao Lai (Microelectron. Reliab., 2013)