Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations. - Gordon Elger; Shri Vishnu Kandaswamy; E. Liu; Alexander Hanss; Maximilian Schmid; Robert Derix; Fosca Conti (Microelectron. J., 2015)

Transient thermal analysis for accelerated reliability testing of LEDs. - Gordon Elger; Dominik Müller; Alexander Hanß; Maximilian Schmid; E. Liu; Udo Karbowski; Robert Derix (Microelectron. Reliab., 2016)

The influence of the phosphor layer as heat source and up-stream thermal masses on the thermal characterization by transient thermal analysis of modern wafer level high power LEDs. - E. Liu; Alexander Hanss; Maximilian Schmid; Gordon Elger (Microelectron. Reliab., 2016)

A New Noise-Suppression Algorithm for Transient Thermal Analysis in Semiconductors Over Pulse Superposition. - Maximilian Schmid; Sri Krishna Bhogaraju; Alexander Hanss; Gordon Elger (IEEE Trans. Instrum. Meas., 2021)