10.6 A Hybrid-Bonded 12.1Tops/mm2 5 6-Core DNN Processor with 2.5Tb/s/mm2 3D Network on Chip. - Phil C. Knag; Gregory K. Chen; Shanshan Xie; Satish Yada; Wei Wu; Yu-Shiang Lin; Alexander Kashirin; Xiemei Meng; Russell Criss; Ana Sonia Leon; Carlos Tokunaga; Ram K. Krishnamurthy; et al. (ISSCC, 2026)