Reliability of lead-free solder in power module with stochastic uncertainty. - Alexandre Micol; Carmen Martin; Olivier Dalverny; Michel Mermet-Guyennet; Moussa Karama (Microelectron. Reliab., 2009)

An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. - Alexandre Micol; A. Zeanh; T. Lhommeau; Stephane Azzopardi; Eric Woirgard; Olivier Dalverny; Moussa Karama (Microelectron. Reliab., 2009)

Importance of test parameters, specimen type and use configuration on the identification of Sn/Ag solder behaviour laws. - Carmen Martin; Alexandre Micol; François Pérès (Microelectron. Reliab., 2018)