Evaluation of lead-free soldering for automotive applications. - Alexandrine Guédon; Eric Woirgard; Christian Zardini (Microelectron. Reliab., 2002)

Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant. - Alexandrine Guédon; Eric Woirgard; Christian Zardini; Guillaume Simon (Microelectron. Reliab., 2003)

Influence of the thermo-mechanical residual state on the power assembly modellization. - Alexandrine Guédon-Gracia; Pascal Roux; Eric Woirgard; Christian Zardini (Microelectron. Reliab., 2004)

First step in the reliability assessment of ultracapacitors used as power source in hybrid electric vehicles. - Walid Lajnef; Jean-Michel Vinassa; Stephane Azzopardi; Olivier Briat; Alexandrine Guédon-Gracia; Christian Zardini (Microelectron. Reliab., 2004)

Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability. - Alexandrine Guédon-Gracia; Eric Woirgard; Christian Zardini (Microelectron. Reliab., 2005)

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage. - Maxime Berthou; P. Retailleau; Hélène Frémont; Alexandrine Guédon-Gracia; C. Jéphos-Davennel (Microelectron. Reliab., 2009)

Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength. - Samed Barnat; Hélène Frémont; Alexandrine Guédon-Gracia; Eric Cadalen (Microelectron. Reliab., 2012)

A methodological approach for predictive reliability: Practical case studies. - Hélène Frémont; Geneviève Duchamp; Alexandrine Guédon-Gracia; Frédéric Verdier (Microelectron. Reliab., 2012)

Virtual prototyping in a Design-for-Reliability approach. - Samed Barnat; Alexandrine Guédon-Gracia; Hélène Frémont (Microelectron. Reliab., 2015)

Effects of salt spray test on lead-free solder alloy. - Alexandrine Guédon-Gracia; Hélène Frémont; Bernard Plano; Jean-Yves Delétage; Kirsten Weide-Zaage (Microelectron. Reliab., 2016)

Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering. - Maxime Barrière; Alexandrine Guédon-Gracia; Eric Woirgard; Serge Bontemps; François Le Henaff (Microelectron. Reliab., 2017)

Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations. - S. Pin; Hélène Frémont; Alexandrine Guédon-Gracia (Microelectron. Reliab., 2017)

High temperature ageing of microelectronics assemblies with SAC solder joints. - Wissam Sabbah; Pierre Bondue; Oriol Avino-Salvado; Cyril Buttay; Hélène Frémont; Alexandrine Guédon-Gracia; Hervé Morel (Microelectron. Reliab., 2017)

Sequential combined thermal cycling and vibration test and simulation of printed circuit board. - Faical Arabi; Alexandrine Guédon-Gracia; Jean-Yves Delétage; Hélène Frémont (Microelectron. Reliab., 2018)

Creep measurement and choice of creep laws for BGA assemblies' reliability simulation. - S. Pin; Alexandrine Guédon-Gracia; Jean-Yves Delétage; Hélène Frémont (Microelectron. Reliab., 2018)