Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers. - John F. McDonald 001; Okan Erdogan; Philip Jacob 001; Paul M. Belemjian; Alexey Gutin; Aamir Zia; Michael Chu; Jin Woo Kim; Ryan Clarke; Nate DeSimone; Sherry Liu; Russell P. Kraft (3DIC, 2009)

Carry Chains for Ultra High-Speed SiGe HBT Adders. - Alexey Gutin; Philip Jacob 001; Michael Chu; Paul M. Belemjian; Mitchell R. LeRoy; Russell P. Kraft; John F. McDonald 001 (IEEE Trans. Circuits Syst. I Regul. Pap., 2011)

Design of High-Speed Register Files Using SiGe HBT BiCMOS Technology. - Xuelian Liu; Srikumar Raman; Ryan Clarke; Mitchell R. LeRoy; Okan Erdogan; Michael Chu; Alexey Gutin; Russell P. Kraft; John F. McDonald 001 (IEEE Trans. Circuits Syst. II Express Briefs, 2014)