Intrinsic reliability of local interconnects for N7 and beyond. - Kris Croes; Alicja Lesniewska; Chen Wu; Ivan Ciofi; Agnieszka Banczerowska; B. Briggs; S. Demuynck; Zsolt Tökei; Jürgen Bömmels; Yves Saad; W. Gao (IRPS, 2015)

Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing. - Deniz Kocaay; Philippe Roussel; Kristof Croes; Ivan Ciofi; Alicja Lesniewska; Ingrid De Wolf (IRPS, 2018)

Insights into metal drift induced failure in MOL and BEOL. - Chen Wu; O. Varela Pedreira; Alicja Lesniewska; Yunlong Li; Ivan Ciofi; Zsolt Tökei; Kris Croes (IRPS, 2018)

Silicon Photonics for 56G NRZ Optical Interconnects. - Joris Van Campenhout; Yoojin Ban; Peter De Heyn; Ashwyn Srinivasan; Jeroen De Coster; Sebastien Lardenois; Brad Snyder; Sadhishkumar Balakrishnan; Guy Lepage; Negin Golshani; Sofie Janssen; Alicja Lesniewska; et al. (OFC, 2018)

Accelerated Device Degradation of High-Speed Ge Waveguide Photodetectors. - Alicja Lesniewska; S. A. Srinivasan; Joris Van Campenhout; Barry J. O'Sullivan; Kris Croes (IRPS, 2019)

Role of Defects in the Reliability of HfO2/Si-Based Spacer Dielectric Stacks for Local Interconnects. - Chen Wu; Adrian Vaisman Chasin; Andrea Padovani; Alicja Lesniewska; Steven Demuynck; Kris Croes (IRPS, 2019)

Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. - Alicja Lesniewska; Philippe J. Roussel; Davide Tierno; Victor Vega-Gonzalez; Marleen H. van der Veen; Patrick Verdonck; Nicolas Jourdan 002; Christopher J. Wilson; Zsolt Tökei; Kris Croes (IRPS, 2020)

Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. - Alicja Lesniewska; Olalla Varela Pedreira; Melina Lofrano; Gayle Murdoch; Marleen H. van der Veen; Anish Dangol; Naoto Horiguchi; Zsolt Tökei; Kris Croes (IRPS, 2021)

Degradation mechanisms in Germanium Electro-Absorption Modulators. - Artemisia Tsiara; Alicja Lesniewska; Philippe Roussel; Srinivasan Ashwyn Srinivasan; Mathias Berciano; Marko Simicic; Marianna Pantouvaki; Joris Van Campenhout; Kristof Croes (IRPS, 2022)

First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP. - Gayle Murdoch; Matin O'Toole; Giulio Marti; Ankit Pokhrel; Diana Tsvetanova; Stefan Decoster; Shreya Kundu; Yusuke Oniki; Arame Thiam; Quoc Toan Le; Olalla Varela Pedreira; Alicja Lesniewska; et al. (VLSI Technology and Circuits, 2022)

Towards accurate temperature prediction in BEOL for reliability assessment (Invited). - Melina Lofrano; Herman Oprins; Xinyue Chang; Bjorn Vermeersch; Olalla Varela Pedreira; Alicja Lesniewska; Vladimir Cherman; Ivan Ciofi; Kristof Croes; Seongho Park; Zsolt Tokei (IRPS, 2023)

BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure. - Y. Fang; Alicja Lesniewska; Ivan Ciofi; Philippe Roussel; Chen Wu; Victor Vega-Gonzalez; Ingrid De Wolf; Kris Croes (IRPS, 2024)

Exploring the Reliability Limits for the Z-Pitch Scaling of Molybdenum Inter-Word Line Oxides in 3D NAND. - Davide Tierno; Antonio Arreghini; Alicja Lesniewska; Y. Jeong; Marleen H. van der Veen; J. Stiers; N. Bazzazian; Ivan Ciofi; Geert Van den Bosch; Maarten Rosmeulen (IRPS, 2024)

Local Electric Field-Aware 3D TDDB Model for BEOL Reliability Predictions. - Y. Fang; Alicja Lesniewska; Ivan Ciofi; Philippe Roussel; I. De Wolf; Kris Croes (IRPS, 2025)

Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps. - Alicja Lesniewska; Y. Fang; G. Delie; Philippe Roussel; Koen Van Sever; Emmanuel Chery; O. Varela Pedreira; Ivan Ciofi; S. H. Park; Zsolt Tokei; Kris Croes (IRPS, 2025)