Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects. - Yi Ram Kim; Allison T. Osmanson; Hossein Madanipour; Choong-Un Kim; Patrick F. Thompson; Qiao Chen (IRPS, 2020)

Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages. - Allison T. Osmanson; Mohsen Tajedini; Yi Ram Kim; Hossein Madanipour; Choong-Un Kim; Bradley Glasscock; Muhammad Khan (IRPS, 2021)