Alok Ranjan

Orcid: 0000-0003-4592-1674

Affiliations:
  • Singapore University of Technology and Design, Engineering Product Development


According to our database1, Alok Ranjan authored at least 7 papers between 2015 and 2020.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of five.

Timeline

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Bibliography

2020
Correlation of Dielectric Breakdown and Nanoscale Adhesion in Silicon Dioxide Thin Films.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019
Dielectric Breakdown in 2D Layered Hexagonal Boron Nitride - The Knowns and the Unknowns.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

Spatio-Temporal Defect Generation Process in Irradiated HfO2 MOS Stacks: Correlated Versus Uncorrelated Mechanisms.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018
Mechanism of soft and hard breakdown in hexagonal boron nitride 2D dielectrics.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016
Conductive filament formation at grain boundary locations in polycrystalline HfO<sub>2</sub> -based MIM stacks: Computational and physical insight.
Microelectron. Reliab., 2016

Analysis of quantum conductance, read disturb and switching statistics in HfO<sub>2</sub> RRAM using conductive AFM.
Microelectron. Reliab., 2016

2015
An SEM/STM based nanoprobing and TEM study of breakdown locations in HfO<sub>2</sub>/SiO<sub>x</sub> dielectric stacks for failure analysis.
Microelectron. Reliab., 2015


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