Material improvement for ultrathin-wafer handling in TSV creation and PECVD process. - Amadine Jouve; Wenbin Hong; D. Blumenshine; JoElle Dachsteiner; Rama Puligadda; Dongshun Bai; J. Diaz; David Henry (3DIC, 2009)

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. - Sylvain Joblot; Alexis Farcy; Nicolas Hotellier; Amadine Jouve; François de Crecy; Arnaud Garnier; M. Argoud; C. Ferrandon; J.-P. Colonna; R. Franiatte; C. Laviron; Séverine Cheramy (3DIC, 2013)

Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. - Amadine Jouve; Y. Sinquin; Arnaud Garnier; M. Daval; Pascal Chausse; M. Argoud; N. Allouti; Laurence Baud; Jérôme Dechamp; R. Franiatte; Séverine Cheramy; H. Kato; et al. (3DIC, 2015)

3D advanced integration technology for heterogeneous systems. - Pascal Vivet; Christian Bernard; Fabien Clermidy; Denis Dutoit; Eric Guthmuller; Ivan Miro Panades; Gaël Pillonnet; Yvain Thonnart; Arnaud Garnier; Didier Lattard; Amandine Jouve; Franck Bana; et al. (3DIC, 2015)

Towards high density 3D interconnections. - Séverine Cheramy; Amadine Jouve; Lucile Arnaud; Claire Fenouillet-Béranger; Perrine Batude; Maud Vinet (3DIC, 2016)

ITAC: A complete 3D integration test platform. - Didier Lattard; Lucile Arnaud; Arnaud Garnier; Nicolas Bresson; Franck Bana; R. Segaud; Amadine Jouve; H. Jacquinot; Stéphane Moreau; Karim Azizi-Mourier; C. Chantre; Pascal Vivet; et al. (3DIC, 2016)

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. - Lucile Arnaud; Stéphane Moreau; Amadine Jouve; Imed Jani; Didier Lattard; F. Fournel; C. Euvrard; Y. Exbrayat; Viorel Balan; Nicolas Bresson; S. Lhostis; J. Jourdon; et al. (IRPS, 2018)

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. - Emilie Bourjot; Paul Stewart; Christophe Dubarry; E. Lagoutte; E. Rolland; Nicolas Bresson; G. Romano; D. Scevola; Viorel Balan; Jérôme Dechamp; Marc Zussy; Gaëlle Mauguen; et al. (3DIC, 2019)

Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. - Amadine Jouve; Loïc Sanchez; Clément Castan; Nicolas Bresson; Frank Fournel; Nicolas Raynaud; Pascal Metzger (3DIC, 2019)