Copper wire interconnect reliability evaluation using in-situ High Temperature Storage Life (HTSL) tests. - Amar Mavinkurve; Leon Goumans; G. M. O'Halloran; Rene T. H. Rongen; Mark-Luke Farrugia (Microelectron. Reliab., 2014)

Moisture absorption and desorption in wafer level chip scale packages. - Kirsten Rongen; Amar Mavinkurve; M. Chen; P. J. van der Wel; F. Swartjes; Rene T. H. Rongen (Microelectron. Reliab., 2015)

Moisture absorption by molding compounds under extreme conditions: Impact on accelerated reliability tests. - Amar Mavinkurve; Jaume L. M. Llacer Martinez; Michiel van Soestbergen; Jeroen J. M. Zaal (Microelectron. Reliab., 2016)

Transient Leakage Current as a Non-destructive Probe of Wire-bond Electrochemical Failures. - Md. Asaduz Zaman Mamun; Amar Mavinkurve; Michiel van Soestbergen; Muhammad Ashraful Alam (IRPS, 2023)

Demystifying the Use of IC Plastic packages for Space Applications. - Md. Asaduz Zaman Mamun; Greta Terzariol; Luke Fortner; Amar Mavinkurve; Muhammad Ashraful Alam (IRPS, 2025)