Beyond-Si materials and devices for more Moore and more than Moore applications. - Nadine Collaert; AliReza Alian; Hiroaki Arimura; Geert Boccardi; Geert Eneman; Jacopo Franco; Tsvetan Ivanov; Dennis Lin; Jérôme Mitard; S. Ramesh; R. Rooyackers; Marc Schaekers; et al. (ICICDT, 2016)

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling. - A. Vandooren; Liesbeth Witters; Jacopo Franco; Arindam Mallik; Bertrand Parvais; Z. Wu; Amey Walke; V. Deshpande; E. Rosseel; Andriy Hikavyy; W. Li; L. Peng; et al. (ICICDT, 2018)

Exploring the DC reliability metrics for scaled GaN-on-Si devices targeted for RF/5G applications. - Vamsi Putcha; Erik Bury; Jacopo Franco; Amey Walke; Simeng Zhao; Uthayasankaran Peralagu; Ming Zhao; AliReza Alian; Ben Kaczer; Niamh Waldron; Dimitri Linten; Bertrand Parvais; et al. (IRPS, 2020)

Improved MW of IGZO-channel FeFET by Reading Scheme Optimization and Interfacial Engineering. - Zhuo Chen; Nicolo Ronchi; Amey Walke; Kaustuv Banerjee; Mihaela Ioana Popovici; Kostantine Katcko; Geert Van den Bosch; Maarten Rosmeulen; Valeri Afanas'ev; Jan Van Houdt (IMW, 2023)