3D TSV based high frequency components for RF IC and RF MEMS applications. - Montserrat Fernandez-Bolaños; Wolfgang A. Vitale; Mariazel Maqueda Lopez; Adrian M. Ionescu; Armin Klumpp; Karl-Reinhard Merkel; Josef Weber; Peter Ramm; Ilja Ocket; Walter De Raedt; Amin Enayati (3DIC, 2016)