A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks. - Max O. Bloomfield; Amogh Wasti; Zongmin Yang; Matthew Galarza; Theodorian Borca-Tasciuc; Jacob Merson; Timothy Chainer; Prabudhya Roy Chowdhury; Aakrati Jain (CoRR, 2026)