The effect of die attach voiding on the thermal resistance of chip level packages. - Amy S. Fleischer; Li-Hsin Chang; Barry C. Johnson (Microelectron. Reliab., 2006)

Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser. - Amy S. Fleischer; Ute Troppenz; Michael Hamacher; Werner John (Microelectron. Reliab., 2006)

Foreword. - Suresh V. Garimella; Amy S. Fleischer (Microelectron. J., 2008)