Thermal correlation between measurements and FEM simulations in 3D ICs. - Papa Momar Souare; François de Crecy; Vincent Fiori; M. Haykel Ben Jamaa; Alexis Farcy; Sébastien Gallois-Garreignot; Andras Borbely; Jean-Philippe Colonna; Perceval Coudrain; B. Giraud; C. Laviron; Séverine Cheramy; et al. (3DIC, 2013)

Using TSVs for thermal mitigation in 3D circuits: Wish and truth. - Cristiano Santos; Papa Momar Souare; François de Crecy; Perceval Coudrain; Jean-Philippe Colonna; Pascal Vivet; Andras Borbely; Ricardo Reis 001; M. Haykel Ben Jamaa; Vincent Fiori; Alexis Farcy (3DIC, 2014)