Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration. - Christoph Sander; Yvonne Standke; Sven Niese; Rüdiger Rosenkranz; André Clausner; Martin Gall; Ehrenfried Zschech (Microelectron. Reliab., 2014)

Prediction of SRAM Reliability Under Mechanical Stress Induced by Harsh En§ironments. - Jens Warmuth; Kay-Uwe Giering; André Lange; André Clausner; Simon Schlipf; Gottfried Kurz; Michael Otto 003; Jens Paul; Roland Jancke; Andreas Aal; Martin Gall; Ehrenfried Zschech (ESSDERC, 2018)

Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation. - André Clausner; Simon Schlipf; Gottfried Kurz; Michael Otto 003; Jens Paul; Kay-Uwe Giering; Jens Warmuth; André Lange; Roland Jancke; Andreas Aal; Rüdiger Rosenkranz; Martin Gall; et al. (IRPS, 2018)

Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling. - Matthias Kraatz; Christoph Sander; André Clausner; Meike Hauschildt; Yvonne Standke; Martin Gall; Ehrenfried Zschech (IRPS, 2018)

Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor. - Simon Schlipf; André Clausner; Jens Paul; Simone Capecchi; Laura Wambera; Karsten Meier; Ehrenfried Zschech (IRPS, 2020)

Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects. - Zhenjun Zhang; Matthias Kraatz; Meike Hauschildt; Seungman Choi; André Clausner; Ehrenfried Zschech; Martin Gall (IRPS, 2021)