Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors. - Daniel Hera; Armin Berndt; Thomas Günther; Stephan Schmiel; Christine Harendt; André Zimmermann (Sensors, 2017)

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates. - Paul Wild; Tobias Grözinger; Dominik Lorenz; André Zimmermann (IEEE Trans. Reliab., 2017)

Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB. - Mahdi Soltani; Moritz Freyburger; Romit Kulkarni; Rainer Mohr; Tobias Groezinger; André Zimmermann (IEEE Access, 2018)

Effect of Joule heating on the reliability of solder joints under power cycling conditions. - Jie Mei; R. Haug; O. Lanier; Tobias Grözinger; André Zimmermann (Microelectron. Reliab., 2018)

Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. - Paul Wild; Dominik Lorenz; Tobias Grözinger; André Zimmermann (Microelectron. Reliab., 2018)

A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation. - Mahdi Soltani; Romit Kulkarni; Tobias Scheinost; Tobias Groezinger; André Zimmermann (IEEE Access, 2019)

Application of human motion energy harvesters on industrial linear technology. - Lukas Lamprecht; Ricardo Ehrenpfordt; Tobias Zoller; André Zimmermann (IET Wirel. Sens. Syst., 2019)

Robust and fast part traceability in a production chain exploiting inherent, individual surface patterns. - Benedikt Wigger; Ingo Koinzer; Thomas Meissner; Maximilian Barth; André Zimmermann (Robotics Comput. Integr. Manuf., 2020)

Inkjet-Printing of Nanoparticle Gold and Silver Ink on Cyclic Olefin Copolymer for DNA-Sensing Applications. - Martin Trotter; Daniel Juric; Zahra Bagherian; Nadine Borst; Kerstin Gläser; Thomas Meissner; Felix von Stetten; André Zimmermann (Sensors, 2020)

Identification of the Viscoelastic Properties of Soft Thermal Interface Layers Through Forward and Inverse Measurement Techniques. - Alaa Fezai; Anuj Sharma; Wolfgang Müller-Hirsch; André Zimmermann (IEEE Trans. Instrum. Meas., 2020)

Quadrature Block for UHF Reflection Coefficient Measurements Using a Directional Coupler and Injection Locking. - Volker Kible; Robson Nunes de Lima; Karolinne B. Brito; André Bülau; André Zimmermann (IEEE Trans. Instrum. Meas., 2020)

Development and Proof of Concept of a Miniaturized MEMS Quantum Tunneling Accelerometer Based on PtC Tips by Focused Ion Beam 3D Nano-Patterning. - Michael Haub; Martin Bogner; Thomas Günther; André Zimmermann; Hermann Sandmaier (Sensors, 2021)

Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. - Adrian Schwenck; Tobias Grözinger; Thomas Günther; Axel Schumacher; Dietmar Schuhmacher; Kai Werum; André Zimmermann (Sensors, 2021)

Characterization and Benchmark of a Novel Capacitive and Fluidic Inclination Sensor. - Adrian Schwenck; Thomas Günther; André Zimmermann (Sensors, 2021)

Graph neural networks for parameter estimation in micro-electro-mechanical system testing. - Monika Elisabeth Heringhaus; Alexander Buhmann; Jürgen Müller; André Zimmermann (Array, 2022)

Towards Reliable Parameter Extraction in MEMS Final Module Testing Using Bayesian Inference. - Monika Elisabeth Heringhaus; Yi Zhang 139; André Zimmermann; Lars Mikelsons (Sensors, 2022)

Inkjet-Printed Temperature Sensors Characterized according to Standards. - Jonas Jäger; Adrian Schwenck; Daniela Walter; André Bülau; Kerstin Gläser; André Zimmermann (Sensors, 2022)

Review on Excess Noise Measurements of Resistors. - Daniela Walter; André Bülau; André Zimmermann (Sensors, 2023)

Meta-learning for few-shot sensor self-calibration to increase stress robustness. - Patrick Tritschler; Torsten Ohms; Bin Yang; André Zimmermann (Eng. Appl. Artif. Intell., 2024)

Product Development Processes for Individualized Products: A Case Study. - Faruk Civelek; Alexander Brem 001; Karl-Peter Fritz; André Zimmermann (IEEE Trans. Engineering Management, 2024)

SPICEAssistant: LLM using SPICE Simulation Tools for Schematic Design of Switched-Mode Power Supplies. - Simon Nau; Jan Krummenauer; André Zimmermann (CoRR, 2025)