Generation of oxide traps in Back-Side-Illuminated CMOS Image Sensors and impact on reliability. - Andrea Vici; Felice Russo; Nicola Lovisi; Aldo Marchioni; Antonio Casella; Fernanda Irrera (ESSDERC, 2019)

Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress. - Kookjin Lee; Ben Kaczer; Anastasiia Kruv; Mario Gonzalez; Geert Eneman; Oguzhan O. Okudur; Alexander Grill; Jacopo Franco; Andrea Vici; Robin Degraeve; Ingrid De Wolf (IRPS, 2022)

Combining SILC and BD statistics for low-voltage lifetime projection in HK/MG stacks. - Andrea Vici; Robin Degraeve; João Pedro Bastos; Philippe Roussel; Ingrid De Wolf (IRPS, 2022)

Using dedicated device arrays for the characterization of TDDB in a scaled HK/MG technology. - Pablo Saraza-Canflanca; Javier Diaz-Fortuny; Andrea Vici; Erik Bury; Robin Degraeve; Ben Kaczer (IRPS, 2023)

Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations. - Andrea Vici; Robin Degraeve; Philippe J. Roussel; Jacopo Franco; Ben Kaczer; Ingrid De Wolf (IRPS, 2023)

Physics-informed machine learning to analyze oxide defect-induced RTN in gate leakage current. - Anirudh Varanasi; Robin Degraeve; Philippe J. Roussel; Andrea Vici; Clement Merckling (IRPS, 2024)

SILC and TDDB reliability of novel low thermal budget RMG gate stacks. - Andrea Vici; Robin Degraeve; Naoto Horiguchi; Ingrid De Wolf; Jacopo Franco (IRPS, 2024)

TDDB Reliability Improvement of Low Thermal Budget RMG Stacks. - G. Molinaro; Hiroaki Arimura; S. Sacchi; Andrea Vici; Robin Degraeve; Ben Kaczer; Naoto Horiguchi; M. Houssa; Jacopo Franco (IRPS, 2025)