Inkjettable conductive adhesive for use in microelectronics and microsystems technology. - Jana Kolbe; Andreas Arp; Francesco Calderone; Edouard Marc Meyer; Wilhelm Meyer; Helmut Schaefer; Manuela Stuve (Microelectron. Reliab., 2007)

2.2 IBM Telum II: Next Generation 5.5GHz Microprocessor with On-Die Data Processing Unit and Improved AI Accelerator. - Gerald Strevig; Christopher J. Berry; Rahul M. Rao; Noam Jungmann; Michael A. Sperling; Michael J. Becht; Eduard Herkel; Matthias Pflanz; Patrick J. Meaney; Michael Romain; Mark Cichanowski; Amanda Venton; et al. (ISSCC, 2025)