Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. - Dionysios Manessis; Rainer Patzelt; Andreas Ostmann; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2004)

Through Silicon Vias as Enablers for 3D Systems - E. Jung; Andreas Ostmann; Peter Ramm; Jürgen Wolf; Michael Toepper; Maik Wiemer (CoRR, 2008)

Stretchable Circuit Board Technology and Application. - Rene Vieroth; Thomas Löher; Manuel Seckel; Christian Dils; Christine Kallmayer; Andreas Ostmann; Herbert Reichl (ISWC, 2009)