Extending the lifetime of power electronic assemblies by increased cooling temperatures. - Aaron Hutzler; Adam Tokarski; Andreas Schletz (Microelectron. Reliab., 2013)

Dielectric strength and thermal performance of PCB-embedded power electronics. - Richard Randoll; Wolfgang Wondrak; Andreas Schletz (Microelectron. Reliab., 2014)

Characteristics and aging of PCB embedded power electronics. - Richard Randoll; Mahmud Asef; Wolfgang Wondrak; Lars Böttcher; Andreas Schletz (Microelectron. Reliab., 2015)

Lifetime and manufacturability of integrated power electronics. - Richard Randoll; Wolfgang Wondrak; Andreas Schletz (Microelectron. Reliab., 2016)

Modeling the rate-dependent inelastic deformation behavior of porous polycrystalline silver films. - S. A. Letz; A. Farooghian; F. B. Simon; Andreas Schletz (Microelectron. Reliab., 2018)

Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples via FE-simulation of power cycles. - F. B. Simon; S. A. Letz; Andreas Schletz (Microelectron. Reliab., 2018)