Analysis of microbump induced stress effects in 3D stacked IC technologies. - Andrej Ivankovic; Geert Van der Plas; V. Moroz; M. Choi; Vladimir Cherman; Abdelkarim Mercha; Paul Marchal; Marcel Gonzalez; Geert Eneman; Wenqi Zhang; Thibault Buisson; Mikael Detalle; et al. (3DIC, 2011)

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. - Wei Guo; Geert Van der Plas; Andrej Ivankovic; Geert Eneman; Vladimir Cherman; Bart De Wachter; Abdelkarim Mercha; Mario Gonzalez; Yann Civale; Augusto Redolfi; Thibault Buisson; A. Jourdan; et al. (ICICDT, 2012)

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging. - Andrej Ivankovic; Kris Vanstreels; Daniel Vanderstraeten; Guy Brizar; Renaud Gillon; Eddy Blansaer; Bart Vandevelde (Microelectron. Reliab., 2012)

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. - Bart Vandevelde; Andrej Ivankovic; B. Debecker; Melina Lofrano; Kris Vanstreels; Wei Guo; Vladimir Cherman; Marcel Gonzalez; Geert Van der Plas; Ingrid De Wolf; Eric Beyne; Zsolt Tokei (Microelectron. Reliab., 2014)

B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages. - Aidan Cowley; Andrej Ivankovic; C. S. Wong; N. S. Bennett; A. N. Danilewsky; Marcel Gonzalez; Vladimir Cherman; Bart Vandevelde; Ingrid De Wolf; Patrick J. McNally (Microelectron. Reliab., 2016)